Short Introduction
Maxtor AP-306 is a non-curing thermal putty designed for high-performance electronic cooling applications. With a thermal conductivity of 11.5 W/mK, excellent electrical insulation, and a wide operating temperature range from -40 deg C to 200 deg C, AP-306 helps fill uneven air gaps between heat-generating components and heatsinks, improving heat transfer in GPUs, power modules, telecom equipment, automotive electronics, and other compact devices.
Maxtor AP-306 is a soft, viscous thermal interface material made with high thermal conductivity fillers and a polymer substrate. Unlike traditional thermal grease used for very thin bond lines, thermal putty is designed to fill larger and uneven gaps between components and cooling structures.
Its soft and moldable texture allows it to conform to irregular component heights, reducing air pockets and improving the thermal path from chips, power devices, memory modules, and other heat sources to heatsinks or metal housings.
AP-306 does not cure during use. This makes it suitable for applications that require easy assembly, rework, or long-term serviceability.
AP-306 is suitable for electronic assemblies where components have different heights or where a soft gap-filling thermal interface is required.
AP-306 can be used between GPU memory chips, VRM components, and heatsinks. It helps fill uneven gaps around high-power components and improves contact with the cooling plate. This makes it suitable for graphics cards, gaming hardware, AI computing modules, and high-performance workstations.
Automotive control modules often contain power devices and compact PCB layouts that require stable thermal management. AP-306 can be applied between electronic components and aluminum housings to improve heat dissipation while maintaining electrical insulation.
Power supplies, MOSFET modules, converters, inverters, and industrial control boards generate concentrated heat during operation. AP-306 can fill air gaps between heat-generating components and heatsinks, helping reduce thermal resistance and improve long-term reliability.
Telecom devices and network equipment often run continuously in compact enclosures. AP-306 is suitable for thermal transfer between semiconductors, power components, and metal shells or heatsinks, especially where the gap is not perfectly flat.
For OEM and ODM projects, AP-306 can be used in applications that need a soft, moldable thermal material with strong conductivity and easy handling. It is suitable for prototypes, small-batch production, and mass production thermal management designs.
Clean the surface before application. Make sure the component surface and heatsink surface are dry, clean, and free from dust, oil, or residue.
Apply a moderate amount of thermal putty onto the target component. AP-306 can be applied directly, by dispensing, or with a brush depending on the production process.
Spread the material evenly over the heat-generating area. The putty should cover the required contact area and fill the gap without excessive overflow.
Assemble the heatsink, cooling plate, or aluminum housing. The soft putty will conform to the component shape and help reduce air gaps.
Control the application thickness. In general, a thinner and more consistent bond line improves thermal transfer, but enough material should be used to fully fill the actual gap.
For stored material, mix evenly before use if a small amount of silicone oil appears on the surface. This is a normal condition and does not affect product performance after mixing.
AP-306 offers a balance of high thermal conductivity, electrical insulation, flexibility, and easy rework. Compared with rigid thermal pads, thermal putty can better adapt to uneven component heights. Compared with liquid thermal grease, it is better suited for applications that require gap filling and stable material placement.
For electronics manufacturers, AP-306 can help simplify thermal design, improve contact between components and heatsinks, and support more reliable heat dissipation in compact devices.
AP-306 should be stored in a dry and cool place. Avoid rain, direct sunlight, and high-temperature storage environments. The recommended storage period is 60 months at 25 deg C. Keep the product away from children. If it contacts the skin, wipe it clean and rinse with water. If it contacts the eyes, rinse immediately with water and seek medical attention.
Maxtor provides AP-306 thermal putty for electronics manufacturers, thermal solution providers, and OEM/ODM projects. Contact us to request samples, technical data sheets, MSDS documents, or customized packaging options.
Call to Action
Need a high-conductivity thermal putty for your electronic cooling project? Contact Maxtor to get AP-306 samples, quotation, and technical support.
