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AP-12 14.8W/mk Thermal Pad

Item No.: AP-12
Maxtor AP-12 Thermal Pad ensures efficient heat dissipation for electronic components with a high thermal conductivity of 14.8W/m·K. This pre-formed pad features easy installation by peeling and placing, eliminating mess, and offers excellent electrical i
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Description

Maxtor AP-12 High Performance Thermal Pad

Thermal Conductivity: 14.8W/m·K
Designed for efficient cooling of components like VRMs, memory modules, and chipsets.

Excellent Thermal Performance

Easy & Clean Application - Pre-formed, no mess

Long-Term Reliability & Durability

Electrically Insulating - Safe for use on sensitive components

Applicable with aluminum heatsinks and various other surfaces. Ideal for use in computers, graphics cards, and power supplies.

Product Name AP-12 thermal pad
Operating Temperature -50°C+250°C
Hardness 30~55 Sc
Material Silicone thermal material
Application Memory chips (VRAM/GDDR)MotherboardcomponentsSSD/M.2 drivesIntegrated circuits (lCs), etc
Thermal conductivity 14.8W/mk
Color grey
Size 120MM * 120MM / 85MM * 45MM / 120MM * 20MM
Thickness 0.5MM/1MM/1.5MM/2MM/2.5MM/3MM
Certifications RoHS, REACH, ISO

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Thermal Pad FAQ

1. What is a thermal pad?
A thermal pad is a soft, thermally conductive material designed to fill microscopic air gaps between heat-generating components such as CPUs, GPUs, or ICs and the heat sink. By improving surface contact, it enhances heat transfer efficiency and maintains stable device performance.

2. What materials are thermal pads made of?
Thermal pads are usually made from silicone-based compounds combined with thermally conductive fillers such as ceramic, graphite, or metal oxides. These fillers improve heat conduction while maintaining flexibility and insulation.

3. How is a thermal pad different from thermal paste?
A thermal pad is a solid and flexible sheet that is easy to apply and remove, providing consistent coverage without mess. Thermal paste, also known as thermal grease, offers slightly higher thermal conductivity but requires careful application and cleaning. Thermal pads are preferred for stable, clean, and repeatable installations.

4. How do I choose the right thermal pad?
The main factors to consider are thermal conductivity, thickness, hardness, and insulation. Higher thermal conductivity means better heat transfer. The correct thickness should match the gap between components. The hardness and compressibility must ensure full surface contact without damaging parts. Electrical insulation is essential when working with sensitive circuits. For high-performance systems, pads with a conductivity of 10 W/m·K or above are recommended. For example, model AP-14 provides a thermal conductivity of 16.8 W/m·K, suitable for high-power applications.

5. How do I install a thermal pad correctly?
First, clean both surfaces thoroughly. Then remove the protective films on both sides of the pad. Place the pad evenly between the component and the heat sink. Apply uniform pressure to ensure complete contact and eliminate air gaps. Proper installation ensures maximum thermal efficiency and reliable heat dissipation.

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