| Product Name | XTP-001 Phase Change |
| Thermal Resistance | 0.04°c.cm/W |
| Size | 20MM * 30MM/31MM * 50MM/38MM * 38MM/25MM * 25MM |
| Operation Temperature | -40°C~+200°C |
| Application | CPU/GPU/MCU |
| Thermal conductivity | 22.5W/mk |
| Thickness | 0.25mm |
| Certifications | RoHS, REACH, ISO |
1. What is a thermal pad?
A thermal pad is a soft, thermally conductive material designed to fill microscopic air gaps between heat-generating components such as CPUs, GPUs, or ICs and the heat sink. By improving surface contact, it enhances heat transfer efficiency and maintains stable device performance.
2. What materials are thermal pads made of?
Thermal pads are usually made from silicone-based compounds combined with thermally conductive fillers such as ceramic, graphite, or metal oxides. These fillers improve heat conduction while maintaining flexibility and insulation.
3. How is a thermal pad different from thermal paste?
A thermal pad is a solid and flexible sheet that is easy to apply and remove, providing consistent coverage without mess. Thermal paste, also known as thermal grease, offers slightly higher thermal conductivity but requires careful application and cleaning. Thermal pads are preferred for stable, clean, and repeatable installations.
4. How do I choose the right thermal pad?
The main factors to consider are thermal conductivity, thickness, hardness, and insulation. Higher thermal conductivity means better heat transfer. The correct thickness should match the gap between components. The hardness and compressibility must ensure full surface contact without damaging parts. Electrical insulation is essential when working with sensitive circuits. For high-performance systems, pads with a conductivity of 10 W/m·K or above are recommended. For example, model AP-14 provides a thermal conductivity of 16.8 W/m·K, suitable for high-power applications.
5. How do I install a thermal pad correctly?
First, clean both surfaces thoroughly. Then remove the protective films on both sides of the pad. Place the pad evenly between the component and the heat sink. Apply uniform pressure to ensure complete contact and eliminate air gaps. Proper installation ensures maximum thermal efficiency and reliable heat dissipation.
